Equivalent circuit parameter extraction of low‐capacitance high‐damping PTs

Modeling power VDMOSFET transistors: Device physics and equivalent circuit model with parameter extraction

A power VDMOSFET has been simulated using PISCES-II, a 2-D numerical device simulator. The doping densities and device dimensions are chosen so as to simulate a typical device structure with one micron channel length. These simulations are aimed at understanding the device physics through various internal electrical quantities like potential distribution, electric field distribution, and electr...

Thermal Parameter Extraction for Bipolar Circuit Modelling

Introduction: Thermal feedback from collector power to emitter temperature has been shown to significantly affect BJT performance.’-4 Recently several worker^^.^ have demonstrated ways to model this thermal feedback in circuit simulation assuming that thermal model parameters are available. This Letter introduces a simple way to extract thermal parameters needed for such simulations. BJT therma...

Parameter Extraction for a Physics-Based Circuit Simulator IGBT Module

A practical parameter extraction method is presented for the Fourier-based-solution physics-based IGBT model. In the extraction procedure, only one simple clamped inductive load test is needed for the extraction of the eleven and thirteen parameters required for the NPT and PT IGBT models, respectively. Validation with experimental results from various structure IGBTs demonstrates the accuracy ...

The Application of Genetic Algorithms to Parameter Estimation in Lead-Acid Battery Equivalent Circuit Models

Rf Equivalent-circuit Model of Interconnect Bends Based on S-parameter Measurements

A modified model for RF interconnect bends on lossy substrate in CMOS technology is presented. The model parameters are extracted directly from the on-wafer S-parameter measurements. The accuracy is verified up to 20 GHz by the measurements of the test structures. © 2005 Wiley Periodicals, Inc. Microwave Opt Technol Lett 45: 170–173, 2005; Published online in Wiley InterScience (www.interscienc...